MC68HC708MP16 Datasheet, PDF (375/398 Pages) Freescale Semiconductor, Inc – Microcontrollers

Electrical Specifications
21.9 TImer Interface Module Characteristics
Table 21-7. TIM Timing
Characteristic
Input Capture Pulse Width
Input Clock Pulse Width
Symbol
t_TIH,t_TIL
t_TCH,t_TCL
Min
125
(1/f_OP) + 5
Max
Unit
—
ns
—
ns
21.10 Clock Generation Module Electrical Characteristics
Table 21-8. CGM Component Specifications
Characteristic
Crystal Load Capacitance
Crystal Fixed Capacitance
Crystal Tuning Capacitance
Feedback Bias Resistor
Series Resistor
Filter Capacitor
Bypass Capacitor
Symbol Min
Typ
Max
Notes
C_L
—
—
—
Consult Crystal
Manufacturing Data
C₁
—
2*C_L
—
Consult Crystal
Manufacturing Data
C₂
—
2*C_L
—
Consult Crystal
Manufacturing Data
R_B
R_S
C_F
C_BYP
—
22 MΩ
—
0
330 kΩ
1 MΩ
Not Required
—
C_FACT*
(V_DDA/f_XCLK)
—
C_BYP must provide low AC
impedance from
—
0.1 µF
—
f = f_XCLK/100 to 100*f_VCLK,
so series resistance must
be considered.
Table 21-9. CGM Operating Conditions
Characteristic
Crystal Reference Frequency
Range Nominal Multiplier
VCO Center-of-Range Frequency
VCO Frequency Multiplier
VCO Center of Range Multiplier
VCO Operating Frequency
Symbol
f_XCLK
f_NOM
f_VRS
N
L
f_VCLK
Min
1MHz
—
4.9152
MHz
1
1
f_VRSMIN
Typ
—
4.9152 MHz
—
—
—
—
Max
8 MHz
—
32.8
MHz
15
15
f_VRSMAX
MC68HC708MP16 — Rev. 3.1
Freescale Semiconductor
Electrical Specifications
Technical Data
375