S912XEG128J2MAA Datasheet, PDF (1208/1324 Pages) Freescale Semiconductor, Inc – Microcontrollers

Appendix A Electrical Characteristics
Table A-5. Thermal Package Characteristics (9S12XEP100)⁽¹⁾
Num C
Rating
Symbol
Min
Typ
Max
Unit
208MAPBGA
1 D Thermal resistance 208MAPBGA, single sided PCB²
θ_JA
—
—
53
°C/W
2 D Thermal resistance208MAPBGA, double sided PCB
θ_JA
—
—
31
°C/W
with 2 internal planes³
3 D Junction to Board 208MAPBGA⁽²⁾
4 D Junction to Case 208MAPBGA⁴
5 D Junction to Package Top 208MAPBGA⁵
θ_JB
—
—
20
°C/W
θ_JC
—
—
9
°C/W
Ψ_JT
—
—
2
°C/W
LQFP144
6 D Thermal resistance LQFP144, single sided PCB³
θ_JA
—
—
41
°C/W
7 D Thermal resistance LQFP144, double sided PCB
with 2 internal planes³
θ_JA
—
—
32
°C/W
8 D Junction to Board LQFP 144
9 D Junction to Case LQFP 144⁴
10 D Junction to Package Top LQFP144⁵
θ_JB
—
—
22
°C/W
θ_JC
—
—
7.4
°C/W
Ψ_JT
—
—
3
°C/W
LQFP112
11 D Thermal resistance LQFP112, single sided PCB⁽³⁾
θ_JA
—
—
43
°C/W
12 D Thermal resistance LQFP112, double sided PCB
with 2 internal planes⁽⁴⁾
θ_JA
—
—
32
°C/W
13 D Junction to Board LQFP112
14 D Junction to Case LQFP112⁴
15 D Junction to Package Top LQFP112⁵
θ_JB
—
—
22
°C/W
θ_JC
—
—
7
°C/W
Ψ_JT
—
—
3
°C/W
QFP80
16 D Thermal resistance QFP 80, single sided PCB³
θ_JA
—
—
45
°C/W
17 D Thermal resistance QFP 80, double sided PCB
with 2 internal planes³
θ_JA
—
—
33
°C/W
18 D Junction to Board QFP 80
θ_JB
—
—
19
°C/W
19 D Junction to Case QFP 80⁽⁵⁾
θ_JC
—
—
11
°C/W
20 D Junction to Package Top QFP 80⁽⁶⁾
Ψ_JT
—
—
3
°C/W
1. The values for thermal resistance are achieved by package simulations for the 9S12XEP100 die.
2. Measured per JEDEC JESD51-8. Measured on top surface of the board near the package.
3. Junction to ambient thermal resistance, θ_JA was simulated to be equivalent to the JEDEC specification JESD51-2 in a
horizontal configuration in natural convection.
4. Junction to ambient thermal resistance, θ_JA was simulated to be equivalent to the JEDEC specification JESD51-7 in a
horizontal configuration in natural convection.
5. Junction to case thermal resistance was simulated to be equivalent to the measured values using the cold plate technique with
the cold plate temperature used as the “case” temperature. This basic cold plate measurement technique is described by MIL-
STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when the package is
being used with a heat sink.
6. Thermal characterization parameter Ψ_JT is the “resistance” from junction to reference point thermocouple on top center of the
case as defined in JESD51-2. Ψ_JT is a useful value to use to estimate junction temperature in a steady state customer
enviroment.
1208
MC9S12XE-Family Reference Manual Rev. 1.25
Freescale Semiconductor