TDA3MV Datasheet, PDF (40/256 Pages) Texas Instruments – TDA3x SoC for Advanced Driver Assistance Systems (ADAS) 15mm Package (ABF) Silicon Revision 2.0

TDA3MV, TDA3MA
TDA3LX, TDA3LA
SPRS964C – JUNE 2016 – REVISED JULY 2017
www.ti.com
Table 4-2. Ball Characteristics⁽¹⁾ (continued)
BALL NUMBER [1]
BALL NAME [2]
SIGNAL NAME [3]
MA/LX/LA MUXMODE
[4]
[5]
TYPE [6]
BALL
RESET
STATE [7]
BALL
RESET
REL.
STATE [8]
BALL
RESET
I/O
REL. VOLTAGE
MUXMODE VALUE [10]
[9]
POWER
[11]
HYS [12]
BUFFER
TYPE [13]
PULL
UP/DOWN
TYPE [14]
DSIS [15]
D22
xo_osc0
xo_osc0
0
O
0
1.8
vdda_osc Yes
LVCMOS PD
Analog
C21
xo_osc1
xo_osc1
0
A
0
1.8
vdda_osc Yes
LVCMOS PD
Analog
M1
xref_clk0
xref_clk0
clkout0
spi3_cs0
0
I
PD
PD
15
1.8/3.3
vddshv1 Yes
Dual
PU/PD
1
O
Voltage
LVCMOS
4
IO
1
spi2_cs1
5
IO
1
spi1_cs0
6
IO
1
spi1_cs1
7
IO
1
gpio3_31
14
IO
Driver off
15
I
(1) NA in this table stands for Not Applicable.
(2) For more information on recommended operating conditions, see Table 5-4, Recommended Operating Conditions.
(3) The pullup or pulldown block strength is equal to: minimum = 50 μA, typical = 100 μA, maximum = 250 μA.
(4) The output impedance settings of this IO cell are programmable; by default, the value is DS[1:0] = 10, this means 40 Ω. For more information on DS[1:0] register configuration, see the
Device TRM.
(5) In PUx / PDy, x and y = 60 to 300 μA.
The output impedance settings (or drive strengths) of this IO are programmable (60 Ω, 80 Ω, 120 Ω) depending on the values of the I[2:0] registers.
4.3 Multiplexing Characteristics
Table 4-3 describes the device multiplexing (no characteristics are available in this table).
NOTE
This table doesn't take into account subsystem multiplexing signals. Subsystem multiplexing signals are described in Section 4.4, Signal
Descriptions.
NOTE
For more information, see the Control Module / Control Module Functional Description / Pad Configuration Registers section of the Device
TRM.
40
Terminal Configuration and Functions
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