TDA3MV Datasheet, PDF (234/256 Pages) Texas Instruments – TDA3x SoC for Advanced Driver Assistance Systems (ADAS) 15mm Package (ABF) Silicon Revision 2.0

TDA3MV, TDA3MA
TDA3LX, TDA3LA
SPRS964C – JUNE 2016 – REVISED JULY 2017
www.ti.com
DDR_1V5
A2
A3
A2
A3
=
Rcp
AT
AT
Rcp
Cac
0.1 µF
SPRS91v_PCB_DDR3_10
Figure 8-53. CK Routing for Two Mirrored DDR3 Devices
Rtt
A2
A3
AT
Vtt
=
SPRS91v_PCB_DDR3_11
Figure 8-54. ADDR_CTRL Routing for Two Mirrored DDR3 Devices
8.9.2.13.2 Two DDR3 Devices
Two DDR3 devices are supported on the DDR EMIF consisting of two x8 DDR3 devices arranged as one
bank (CS), 16 bits wide, or two x16 DDR3 devices arranged as one bank (CS), 32 bits wide. These two
devices may be mounted on a single side of the PCB, or may be mirrored in a pair to save board space at
a cost of increased routing complexity and parts on the backside of the PCB.
8.9.2.13.2.1 CK and ADDR_CTRL Topologies, Two DDR3 Devices
Figure 8-55 shows the topology of the CK net classes and Figure 8-56 shows the topology for the
corresponding ADDR_CTRL net classes.
234 Applications, Implementation, and Layout
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