TDA3MV Datasheet, PDF (215/256 Pages) Texas Instruments – TDA3x SoC for Advanced Driver Assistance Systems (ADAS) 15mm Package (ABF) Silicon Revision 2.0

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TDA3MV, TDA3MA
TDA3LX, TDA3LA
SPRS964C – JUNE 2016 – REVISED JULY 2017
8.8.2.2.2 Compatible JEDEC DDR2 Devices
Table 8-23 shows the parameters of the JEDEC DDR2 devices that are compatible with this interface.
Generally, the DDR2 interface is compatible with x16/x32 DDR2-800 speed grade DDR2 devices.
Table 8-23. Compatible JEDEC DDR2 Devices (Per Interface)
NO.
CJ21
PARAMETER
JEDEC DDR2 device speed grade⁽¹⁾
MIN
DDR2-800
CJ22
JEDEC DDR2 device bit width
x16
CJ23
JEDEC DDR2 device count⁽²⁾
1
(1) Higher DDR2 speed grades are supported due to inherent JEDEC DDR2 backwards compatibility.
(2) One DDR2 device is used for a 16-bit DDR2 and 32-bit DDR2 memory system.
MAX
x32
1
UNIT
Bits
Devices
8.8.2.2.3 PCB Stackup
The minimum stackup required for routing the Device is a six-layer stackup as shown in Table 8-24.
Additional layers may be added to the PCB stackup to accommodate other circuitry or to reduce the size
of the PCB footprint.
LAYER
1
2
3
4
5
6
Table 8-24. Minimum PCB Stackup
TYPE
Signal
Plane
Plane
Signal
Plane
Signal
DESCRIPTION
External Routing
Ground
Power
Internal routing
Ground
External Routing
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Applications, Implementation, and Layout 215
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