TDA3MV Datasheet, PDF (254/256 Pages) Texas Instruments – TDA3x SoC for Advanced Driver Assistance Systems (ADAS) 15mm Package (ABF) Silicon Revision 2.0

PACKAGE OPTION ADDENDUM
www.ti.com
2-Aug-2017
PACKAGING INFORMATION
Orderable Device
TDA3LXRBFABFQ1
TDA3LXRBFABFRQ1
TDA3MADBABFQ1
TDA3MADBABFRQ1
TDA3MVRBFABFQ1
Status Package Type Package Pins Package
(1)
Drawing
Qty
ACTIVE FCBGA
ABF 367 90
Eco Plan
(2)
TBD
ACTIVE FCBGA
ABF 367 1000
TBD
ACTIVE FCBGA
ABF 367
1
TBD
ACTIVE FCBGA
ABF 367 1000
TBD
ACTIVE FCBGA
ABF 367
1
TBD
Lead/Ball Finish
(6)
Call TI
Call TI
Call TI
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MSL Peak Temp
(3)
Call TI
Op Temp (°C)
-40 to 125
Call TI
-40 to 125
Call TI
-40 to 125
Call TI
-40 to 125
Call TI
-40 to 125
Device Marking
(4/5)
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance}
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) _{MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
(4) _{There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.}
(5) _{Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation}
of the previous line and the two combined represent the entire Device Marking for that device.
(6) _{Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish}
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
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