TDA3MV Datasheet, PDF (217/256 Pages) Texas Instruments – TDA3x SoC for Advanced Driver Assistance Systems (ADAS) 15mm Package (ABF) Silicon Revision 2.0

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TDA3MV, TDA3MA
TDA3LX, TDA3LA
SPRS964C – JUNE 2016 – REVISED JULY 2017
8.8.2.2.4 Placement
Figure 8-40 shows the required placement for the Device as well as the DDR2 devices. The dimensions
for this figure are defined in Table 8-26. The placement does not restrict the side of the PCB on which the
devices are mounted. The ultimate purpose of the placement is to limit the maximum trace lengths and
allow for proper routing space. For a 16-bit DDR memory system, the high-word DDR2 device is omitted
from the placement.
DDR2
Memory
X1
A1
DDR2 Controller
Y1
PCB_DDR2_3
Figure 8-40. Device and DDR2 Device Placement
Table 8-26. Placement Specifications DDR2
NO.
PARAMETER
MIN
MAX
UNIT
KOD21
X1
1100
Mils
KOD22
Y1
KOD24
DDR2 keepout region ⁽¹⁾
KOD25
Clearance from non-DDR2 signal to DDR2 keepout region ^{(2) (3)}
4
500
Mils
W
(1) DDR2 keepout region to encompass entire DDR2 routing area.
(2) Non-DDR2 signals allowed within DDR2 keepout region provided they are separated from DDR2 routing layers by a ground plane.
(3) If a device has more than one DDR controller, the signals from the other controller(s) are considered non-DDR2 and should be
separated by this specification.
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Applications, Implementation, and Layout 217
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