PD17012_15 Datasheet, PDF (314/320 Pages) Renesas Technology Corp – 4-BIT SINGLE-CHIP MICROCONTROLLERS WITH DIGITAL TUNING SYSTEM HARDWARE

µPD17012, 17P012
28. RECOMMENDED SOLDERING CONDITIONS
The µPD17012 and 17P012 should be soldered and mounted under the following recommended conditions.
For details of the recommended soldering conditions, refer to the document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended, contact an NEC sales representative.
Table 28-1. Surface Mounting Type Soldering Conditions
(1) µPD17012GF-xxx-3BE: 64-pin plastic QFP (14 × 20)
µPD17P012GF-3BE: 64-pin plastic QFP (14 × 20)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Twice or less, Exposure limit: 7 days^Note (after that, prebake at 125°C
for 20 hours)
IR35-207-2
VPS
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
Count: Twice or less, Exposure limit: 7 days^Note (after that, prebake at 125°C
for 20 hours)
VP15-207-2
Wave soldering
Soldering bath temperature: 260°C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120°C max. (package surface temperature), Exposure
limit: 7 days^Note (after that, prebake at 125°C for 20 hours)
WS60-207-1
Partial heating Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
−
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
(2) µPD17012GC-xxx-8BT: 80-pin plastic QFP (14 × 14)
µPD17P012GC-8BT: 80-pin plastic QFP (14 × 14)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher), IR35-00-2
Count: Twice or less
VPS
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher), VP15-00-2
Count: Twice or less
Wave soldering
Soldering bath temperature: 260°C max., Time: 10 seconds max., Count: Once, WS60-00-1
Preheating temperature: 120°C max. (package surface temperature)
Partial heating Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
−
Caution Do not use different soldering methods together (except for partial heating).
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Data Sheet U10101EJ4V0DS