MC68HC08AZ60 Datasheet, PDF (420/452 Pages) Motorola, Inc – Advance Information

Specifications
Freescale Semiconductor, Inc.
Mechanical Specifications
64-Pin Quad Flat Pack (QFP)
L
48
49
33
32
-A-
L
-B-
B
V
B
B
P
- A, B, D -
Detail A
F
Detail A
64
17
1
16
-D-
A
0.20 M C A – B S D S
0.05 A – B
S
0.20 M H A – B S D S
Detail C
E
M
C
-C-
H
G
Seating
Plane
-H-
Datum
Plane
0.01
M
J
N
D
Base
Metal
0.20 M C A – B S D S
Section B–B
U
T
R
Q
K
W
X
Detail C
Dim. Min.
Max.
Notes
Dim. Min.
Max.
A
13.90 14.10 1. Dimensions and tolerancing per ANSI Y 14.5M, 1982.
M
5°
10°
B
13.90 14.10 ^{2. All dimensions in mm.}
N
C
2.15
2.45 ^{3. Datum Plane –H– is located at bottom of lead and is coincident with} P
the lead where the lead exits the plastic body at the bottom of the part-
D
0.30
0.45 _{ing line.}
Q
E
2.00
2.40 _{4. Datums A–B and –D to be determined at Datum Plane –H–.}
R
0.13
0.17
0.40 BSC
0°
7°
0.13
0.30
F
0.30
0.40 5. Dimensions S and V to be determined at seating plane –C–.
S
16.95 17.45
G
0.80 BSC
6. Dimensions A and B do not include mould protrusion. Allowable
T
0.13
—
H
—
0.25 ^{mould protrusion is 0.25mm per side. Dimensions A and B do include} U
0°
—
mould mismatch and are determined at Datum Plane –H–.
J
0.13
0.23 _{7. Dimension D does not include dambar protrusion. Allowable dam-} V
16.95 17.45
K
0.65
0.95 _{bar protrusion shall be 0.08 total in excess of the D dimension at max-} W
0.35
0.45
L
12.00 REF
imum material condition. Dambar cannot be located on the lower
radius or the foot.
X
1.6 REF
MC68HC08AZ60 — Rev 1.0
420
Specifications
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14-specs
MOTOROLA