DS031 Datasheet, PDF (211/318 Pages) Xilinx, Inc – Summary of Features

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Virtex-II Platform FPGAs: Pinout Information
FF896 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch)
Figure 7: FF896 Flip-Chip Fine-Pitch BGA Package Specifications
FF1152 Flip-Chip Fine-Pitch BGA Package
As shown in Table 12, XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Virtex-II devices are available in the FF1152
flip-chip fine-pitch BGA package. Pins in each of these devices are the same, except for the pin differences in the XC2V3000
DS031-4 (v3.5) November 5, 2007
Product Specification
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Module 4 of 4
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