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| PIC18F97J60_11 Datasheet, PDF (429/492 Pages) Microchip Technology – 64/80/100-Pin, High-Performance, 1-Mbit Flash Microcontrollers with Ethernet | |||
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PIC18F97J60 FAMILY
28.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings(â )
Ambient temperature under bias.............................................................................................................-40°C to +100°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any digital only input pin or MCLR with respect to VSS (except VDD) ........................................ -0.3V to 6.0V
Voltage on any combined digital and analog pin with respect to VSS ............................................. -0.3V to (VDD + 0.3V)
Voltage on VDDCORE with respect to VSS................................................................................................... -0.3V to 2.75V
Voltage on VDD with respect to VSS ........................................................................................................... -0.3V to 4.0V
Total power dissipation (Note 1) ...............................................................................................................................1.0W
Maximum current out of VSS pin ...........................................................................................................................300 mA
Maximum current into VDD pin ..............................................................................................................................250 mA
Input clamp current, IIK (VI < 0 or VI > VDD) (Note 2)ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï® ï±0 mA
Output clamp current, IOK (VO < 0 or VO > VDD) (Note 2) ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï® ï±0 mA
Maximum output current sunk by any PORTB and PORTC I/O pins......................................................................25 mA
Maximum output current sunk by any PORTD, PORTE and PORTJ I/O pins ..........................................................8 mA
Maximum output current sunk by any PORTA, PORTF, PORTG and PORTH I/O pins (Note 3) .............................2 mA
Maximum output current sourced by any PORTB and PORTC I/O pins.................................................................25 mA
Maximum output current sourced by any PORTD, PORTE and PORTJ I/O pins .....................................................8 mA
Maximum output current sourced by any PORTA, PORTF, PORTG and PORTH I/O pins (Note 3) ........................2 mA
Maximum current sunk byï all ports combined.......................................................................................................200 mA
Maximum current sourced by all ports combined..................................................................................................200 mA
Note 1: Power dissipation is calculated as follows:
Pdis = VDD x {IDD â ï¥ IOH} + ï¥ {(VDD â VOH) x IOH} + ï¥ï (VOL x IOL) + ï¥ï (VTPOUT x ITPOUT)
2: No clamping diodes are present.
3: Exceptions are RA<1> and RA<0>, which are capable of directly driving LEDs up to 25 mA.
â NOTICE: Stresses above those listed under âAbsolute Maximum Ratingsâ may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
ï£ 2011 Microchip Technology Inc.
DS39762F-page 429
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