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EP2S130F1020I4 Datasheet, PDF (749/768 Pages) List of Unclassifed Manufacturers – Stratix II Device Handbook, Volume 1 | |||
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High-Speed Board Layout Guidelines
Figure 11â12. Separating Traces for Crosstalk
A
A
4A
Compared with high dielectric materials, low dielectric materials help
reduce the thickness between the trace and ground plane while
maintaining signal integrity. Figure 11â13 plots the relationship of height
versus dielectric constant using the microstrip impedance and stripline
impedance equations, keeping impedance, width, and thickness
constant.
Figure 11â13. Height Versus Dielectric Constant
30
25
20
H (mil) 15
10
5
0
2.2
2.9
3.3
4.1
4.5
εr
Microstrip
Stripline
T = 1.4
Z0 = 50 Ω
Wstripline = 9.0 mils
Wmicrostrip = 8.0 mils
Signal Trace Routing
Proper routing helps to maintain signal integrity. To route a clean trace,
you should perform simulation with good signal integrity tools. The
following section describes the two different types of signal traces
available for routing, single-ended traces, and differential pair traces.
Altera Corporation
May 2007
11â13
Stratix II Device Handbook, Volume 2
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