EP2S130F1020I4 Datasheet, PDF (725/768 Pages) List of Unclassifed Manufacturers – Stratix II Device Handbook, Volume 1

Package Information for Stratix II & Stratix II GX Devices
Tables 10–9 and 10–10 show the package information and package outline
figure references, respectively, for the 672-pin FBGA packaging.
Table 10–9. 672-Pin FBGA Package Information
Description
Specification
Ordering code reference
F
Package acronym
FBGA
Substrate material
BT
Solder ball composition
Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference
MS-034 Variation: AAL-1
Maximum Lead coplanarity
0.008 inches (0.20 mm)
Weight
7.7 g
Moisture Sensitivity level
Printed on moisture barrier bag
Table 10–10. 672-Pin FBGA Package Outline Dimensions
Symbol
Millimeters
Min.
Nom.
A
–
–
A1
0.30
–
A2
0.25
–
A3
–
–
D
27.00 BSC
E
27.00 BSC
b
0.50
0.60
e
1.00 BSC
Max.
3.50
–
3.00
2.50
0.70
Altera Corporation
May 2007
10–7
Stratix II GX Device Handbook, Volume 2