EP2S130F1020I4 Datasheet, PDF (727/768 Pages) List of Unclassifed Manufacturers – Stratix II Device Handbook, Volume 1

Package Information for Stratix II & Stratix II GX Devices
780-Pin FBGA - Flip Chip
■ All dimensions and tolerances conform to ASME Y14.5M - 1994.
■ Controlling dimension is in millimeters.
■ Pin A1 may be indicated by an ID dot, or a special feature, in its
proximity on package surface.
Tables 10–11 and 10–12 show the package information and package
outline figure references, respectively, for the 780-pin FBGA packaging.
Table 10–11. 780-Pin FBGA Package Information
Description
Ordering code reference
Package acronym
Substrate material
Solder ball composition
JEDEC outline reference
Maximum lead coplanarity
Weight
Moisture Sensitivity Level
Specification
F
FBGA
BT
Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
MS-034 variation: AAM-1
0.008 inches (0.20 mm)
8.9 g
Printed on moisture barrier bag
Table 10–12. 780-Pin FBGA Package Outline Dimensions
Symbol
A
A1
A2
A3
D
E
b
e
Min.
–
0.30
0.25
–
0.50
Millimeters
Nom.
–
–
–
–
29.00 BSC
29.00 BSC
0.60
1.00 BSC
Max.
3.50
–
3.00
2.50
0.70
Altera Corporation
May 2007
10–9
Stratix II GX Device Handbook, Volume 2