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EP2S130F1020I4 Datasheet, PDF (729/768 Pages) List of Unclassifed Manufacturers – Stratix II Device Handbook, Volume 1 | |||
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Package Information for Stratix II & Stratix II GX Devices
1,020-Pin FBGA - Flip Chip
â All dimensions and tolerances conform to ASME Y14.5M - 1994.
â Controlling dimension is in millimeters.
â Pin A1 may be indicated by an ID dot, or a special feature, in its
proximity on package surface.
Tables 10â13 and 10â14 show the package information and package
outline figure references, respectively, for the 1,020-pin FBGA packaging.
Table 10â13. 1,020-Pin FBGA Package Information
Description
Specification
Ordering code reference
F
Package acronym
FBGA
Substrate material
BT
Solder ball composition
Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC outline reference
MS-034 variation: AAP-1
Maximum lead coplanarity
0.008 inches (0.20 mm)
Weight
11.5 g
Moisture sensitivity level
Printed on moisture barrier bag
Table 10â14. 1,020-Pin FBGA Package Outline Dimensions
Symbol
Millimeters
Min.
Nom.
A
â
â
A1
0.30
â
A2
0.25
â
A3
â
â
D
33.00 BSC
E
33.00 BSC
b
0.50
0.60
e
1.00 BSC
Max.
3.50
â
3.00
2.50
0.70
Altera Corporation
May 2007
10â11
Stratix II GX Device Handbook, Volume 2
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