EP2S130F1020I4 Datasheet, PDF (723/768 Pages) List of Unclassifed Manufacturers – Stratix II Device Handbook, Volume 1

Package
Outlines
Altera Corporation
May 2007
Package Information for Stratix II & Stratix II GX Devices
The package outlines are listed in order of ascending pin count. Altera
package outlines meet the requirements of JEDEC Publication No. 95.
484-Pin FBGA - Flip Chip
■ All dimensions and tolerances conform to ASME Y14.5M – 1994.
■ Controlling dimension is in millimeters.
■ Pin A1 may be indicated by an ID dot, or a special feature, in its
proximity on the package surface.
Tables 10–7 and 10–8 show the package information and package outline
figure references, respectively, for the 484-pin FBGA packaging.
Table 10–7. 484-Pin FBGA Package Information
Description
Specification
Ordering code reference
F
Package acronym
FBGA
Substrate material
BT
Solder ball composition
Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC outline reference
MS-034 variation: AAJ-1
Maximum lead coplanarity
0.008 inches (0.20 mm)
Weight
5.8 g
Moisture sensitivity level
Printed on moisture barrier bag
Table 10–8. 484-Pin FBGA Package Outline Dimensions (Part 1 of 2)
Symbol
Millimeter
Min.
Nom.
Max.
A
–
–
3.50
A1
0.30
–
–
A2
0.25
–
3.00
A3
–
–
2.50
D
23.00 BSC
E
23.00 BSC
10–5
Stratix II GX Device Handbook, Volume 2