XC3S50 Datasheet, PDF (48/192 Pages) Xilinx, Inc – Revolutionary 90-nanometer process technology

040
R
Spartan-3 FPGA Family:
DC and Switching Characteristics
DS099-3 (v1.3) March 4, 2004
0 0 _{Advance Product Specification}
DC Electrical Characteristics
In this section, some specifications may be designated as
Advance or Preliminary. These terms are defined as fol-
lows:
Advance: Initial estimates based on simulation, early char-
acterization, and/or extrapolation from the characteristics of
other families. Values are subject to change. Use as esti-
mates, not for production.
Preliminary: Based on characterization. Further changes
are not expected.
All parameter limits are representative of worst-case supply
voltage and junction temperature conditions. The following
applies unless otherwise noted: The parameter values pub-
lished in this module apply to all Spartan-3 devices. AC and
DC characteristics are specified using the same numbers
for both commercial and industrial grades. All parameters
representing voltages are measured with respect to GND.
Some specifications list different values for one or more die
revisions. All presently available Spartan-3 devices are
classified as revision 0. Future updates to this module will
introduce further die revisions as needed.
Table 1: Absolute Maximum Ratings
Symbol
Description
Conditions
Min
Max
Units
V_CCINT
Internal supply voltage
–0.5
1.32
V
V_CCAUX
Auxiliary supply voltage
–0.5
3.00
V
V_CCO
V_REF(2)
Output driver supply voltage
Input reference voltage
–0.5
3.75
V
–0.5
V_CCO + 0.5
V
V_IN(2)
Voltage applied to all User I/O pins Driver in a
–0.5
V_CCO + 0.5
V
and Dual-Purpose pins⁽³⁾
high-impedance state
Voltage applied to all Dedicated
pins⁽⁴⁾
–0.5
V_CCAUX+ 0.5
V
T_J
Junction temperature
V_CCO < 3.0V
-
125
°C
T_SOL(5)
Soldering temperature
V_CCO > 3.0V
-
105
°C
-
220
°C
T_STG
Storage temperature
–65
150
°C
Notes:
1. Stresses beyond those listed under Absolute Maximum Ratings will cause permanent damage to the device. These are stress
ratings only; functional operation of the device at these or any other conditions beyond those listed under the Recommended
Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time adversely
affects device reliability.
2. Table 5 specifies the range of values for V_CCO and V_CCAUX, which are used to determine the limits of this parameter.
3. All User I/O and Dual-Purpose pins (DIN/D0, D1–D7, CS_B, RDWR_B, BUSY/DOUT, AND INIT_B) draw power from the V_CCO
power rail of the associated bank.
4. All Dedicated pins (M0–M2, CCLK, PROG_B, DONE, HSWAP_EN, TCK, TDI, TDO, and TMS) draw power from the V_CCAUX rail
(2.5V). For information concerning the use of 3.3V signals, see the 3.3V-Tolerant Configuration Interface section in Module 2:
Functional Description.
5. For soldering guidelines, see the information on "Packaging and Thermal Characteristics" at www.xilinx.com.
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DS099-3 (v1.3) March 4, 2004
www.xilinx.com
1
Advance Product Specification
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