1N4007 Datasheet, PDF (43/236 Pages) Naina Semiconductor ltd. – General Purpose Rectifier 1.0A

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TMS320C6652, TMS320C6654
SPRS841D – MARCH 2012 – REVISED JUNE 2016
5.5 Electrical Characteristics
Over Recommended Ranges of Supply Voltage and Operating Case Temperature (Unless Otherwise Noted)
PARAMETER
TEST CONDITIONS⁽¹⁾
MIN NOM
MAX UNIT
LVCMOS (1.8 V)
I_O = I_OH
DVDD18 - 0.45
V_OH High-level output voltage DDR3
I²C ⁽²⁾
DVDD15 - 0.4
V
LVCMOS (1.8 V)
V_OL Low-level output voltage ^DDR3
I²C
I_O = I_OL
I_O = 3 mA, pulled up to
1.8 V
0.45
0.4 _V
0.4
I_I ⁽³⁾
Input current [DC]
LVCMOS (1.8 V)
No IPD/IPU
Internal pullup
Internal pulldown
-5
50
-170
5
100 170⁽⁴⁾
-100
-50 ^µA
I²C
0.1 × DVDD18 V < V_I <
0.9 × DVDD18 V
-10
10
LVCMOS (1.8 V)
I_OH
High-level output current
[DC]
DDR3
I²C ⁽⁵⁾
-6
-8 mA
LVCMOS (1.8 V)
I_OL
Low-level output current
[DC]
DDR3
I²C
6
8 mA
3
I_OZ ⁽⁶⁾
Off-state output current
[DC]
LVCMOS (1.8 V)
DDR3
I²C
-2
2
-2
2 µA
-2
2
(1) For test conditions shown as MIN, MAX, or TYP, use the appropriate value specified in the recommended operating conditions table.
(2) I²C uses open collector I/Os and does not have a V_OH Minimum.
(3) I_I applies to input-only pins and bidirectional pins. For input-only pins, I_I indicates the input leakage current. For bidirectional pins, I_I
includes input leakage current and off-state (Hi-Z) output leakage current.
(4) For RESETSTAT, max DC input current is 300 µA.
(5) I²C uses open collector I/Os and does not have a I_OH Maximum.
(6) I_OZ applies to output-only pins, indicating off-state (Hi-Z) output leakage current.
5.6 Thermal Resistance Characteristics for [CZH/GZH] Package
NAME
DESCRIPTION
°C/W ^{(1) (2)}
RΘ_JC
RΘ_JB
Junction-to-case
Junction-to-board
0.284
4.200
(1) °C/W = degrees Celsius per watt.
(2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘ_JC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.
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Specifications
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