MC68HC812A4 Datasheet, PDF (340/342 Pages) Motorola, Inc – 16-bit device composed of standard on-chip peripheral modules connected by an intermodule bus. Modules include

Mechanical Specifications
19.3 112-Pin Low-Profile Quad Flat Pack (Case 987)
PIN 1
IDENT
4X
0.20 T L-M N
112
1
VIEW Y
L
4X 28 TIPS
85
0.20 T L-M N
84
J1
J1
CL
4X P
BV
108X G
VIEW Y
X
X=L, M OR N
M
B1 _V1
J
AA
28
29
A1
57
56
N
F
BASE
METAL
D
0.13 M T L-M N
SECTION J1-J1
ROTATED 90 _° COUNTERCLOCKWISE
S1
A
S
C2
C
0.050
θ2
θ3
θ
R R2
R R1
C1
VIEW AB
(K)
θ1
E
(Y)
(Z)
VIEW AB
0.10 T 112X
SEATING
PLANE
T
0.25
GAGE PLANE
NOTES:
1. DIMENSIONS AND TOLERANCES PER ASME
Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. DATUMS L, M AND N TO BE DETERMINED AT
SEATING PLANE, DATUM T.
4. DIMENSIONS S AND V TO BE DETERMINED
AT SEATING PLANE, DATUM T.
5. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.25 PER SIDE.
DIMENSIONS A AND B INCLUDE MOLD
MISMATCH.
6. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL NOT CAUSE THE D
DIMENSION TO EXCEED 0.46.
MILLIMETERS
DIM MIN MAX
A 20.000 BSC
A1 10.000 BSC
B 20.000 BSC
B1 10.000 BSC
C
--- 1.600
C1 0.050 0.150
C2 1.350 1.450
D 0.270 0.370
E 0.450 0.750
F 0.270 0.330
G 0.650 BSC
J 0.090 0.170
K
0.500 REF
P
0.325 BSC
R1 0.100 0.200
R2 0.100 0.200
S 22.000 BSC
S1 11.000 BSC
V 22.000 BSC
V1 11.000 BSC
Y
0.250 REF
Z
1.000 REF
AA 0.090 0.160
θ
0° 8°
θ1
3°
7°
θ2 11° 13°
θ3 11° 13°
MC68HC812A4 — Rev. 3.0
340
Mechanical Specifications
Advance Information
MOTOROLA