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SH7708 Datasheet, PDF (198/625 Pages) Renesas Technology Corp – SuperH™ RISC engine
9 . 1 1 Notes on Board Design
When Using an External Crystal Resonator: Place the crystal resonator, capacitors CL1
and CL2, and damping resistor R close to the EXTAL and XTAL pins. To prevent induction from
interfering with correct oscillation, use a common grounding point for the capacitors connected to
the resonator, and do not locate a wiring pattern near these components.
Avoid crossing
signal lines
CL1
CL2
EXTAL
R
XTAL
SH7708R
Note:The values for CL1, CL2, and the damping resistance should be determined after
consultation with the crystal manufacturer.
Figure 9.8 Points for Attention when Using Crystal Resonator
Decoupling Capacitors: As far as possible, insert a laminated ceramic capacitor of 0.01 to
0.1 µF as a passive capacitor for each VSS/VCC pair. Mount the passive capacitors as close as
possible to the LSI power supply pins, and use components with a frequency characteristic suitable
for the LSI operating frequency, as well as a suitable capacitance value.
Digital system VSS/VCC pairs: 6-7, 17-18, 19-20, 30-31, 41-42, 49-50, 54-55, 59-60, 68-69,
82-81,83, 100-102, 115-116, 121-122, 127-128, 144-139
On-chip oscillator VSS/VCC pairs: 73-75, 76-78, 138-135
When Using a PLL Oscillator Circuit: Keep the wiring from the PLL VCC and VSS
connection pattern to the power supply pins short, and make the pattern width large, to minimize
the inductance component. Ground the oscillation stabilization capacitors C1 and C2 to VSS
(PLL1) and VSS (PLL2), respectively. Place C1 and C2 close to the CAP1 and CAP2 pins and do
not locate a wiring pattern in the vicinity. In clock mode 7, connect the EXTAL pin to VCC or VSS
and leave the XTAL pin open.
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