MC68HC908GR16 Datasheet, PDF (306/310 Pages) Motorola, Inc – Microcontrollers

Freescale Semiconductor, Inc.
Ordering Information and Mechanical Specifications
21.3 48-Pin LQFP (Case #932)
4X
0.200 AB T-U Z
9
A
A1
48
37
1
T
B
B1
12
DETAIL Y
36
U
V
V1
25
P
AE
13
S1
24
Z
S
4X
0.200 AC T-U Z
DETAIL Y
AB
G
0.080 AC
AD
AC
BASE METAL
M°
TOP & BOTTOM
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE AB IS LOCATED AT BOTTOM OF LEAD
AND IS COINCIDENT WITH THE LEAD WHERE THE
LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF
THE PARTING LINE.
4. DATUMS T, U, AND Z TO BE DETERMINED AT DATUM
PLANE AB.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE AC.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.250
PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD
MISMATCH AND ARE DETERMINED AT DATUM PLANE
AB.
AE _{7. DIMENSION D DOES NOT INCLUDE DAMBAR}
PROTRUSION. DAMBAR PROTRUSION SHALL NOT
CAUSE THE D DIMENSION TO EXCEED 0.350.
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
T, U, Z
MILLIMETERS
DIM MIN MAX
A 7.000 BSC
A1 3.500 BSC
B 7.000 BSC
B1 3.500 BSC
C 1.400 1.600
D 0.170 0.270
E 1.350 1.450
F 0.170 0.230
G 0.500 BSC
H 0.050 0.150
J 0.090 0.200
K 0.500 0.700
L 0 × 7×
M
12 _×REF
N 0.090 0.160
P 0.250 BSC
R 0.150 0.250
S 9.000 BSC
S1 4.500 BSC
V 9.000 BSC
V1 4.500 BSC
W 0.200 REF
AA 1.000 REF
R
NJ
F
D
0.080 M AC T-U Z
SECTION AE-AE
CE
H
W
DETAIL AD
L°
K
AA
Data Sheet
306
Ordering Information and Mechanical Specifications
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MC68HC908GR16 — Rev. 1.0
MOTOROLA