XC3S100E Datasheet, PDF (6/193 Pages) Xilinx, Inc – DC and Switching Characteristics

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Introduction and Ordering Information
Ordering Information
Spartan-3E FPGAs are available in both standard and Pb-free packaging options for all device/package combinations. The
Pb-free packages include a ‘G’ character in the ordering code.
Standard Packaging
Example: XC3S250E -4 FT 256 C
Device Type
Speed Grade
Package Type
Temperature Range:
C = Commercial
I = Industrial (T_J
=(T-^J4=0^{o0CoCtoto10805oo}CC))
Number of Pins
DS312_03_011405
Pb-Free Packaging
Example: XC3S250E -4 FT G 256 C
Device Type
Speed Grade
Package Type
Temperature Range:
C = Commercial
I = Industrial (T_J
=(T-^J4=0^{o0CoCtoto10805oo}CC))
Number of Pins
Pb-free
DS312_04_011405
Device
Speed Grade
Package Type / Number of Pins
XC3S100E –4 Standard Performance VQ(G)100 100-pin Very Thin Quad Flat Pack (VQFP)
Temperature Range (T_J)
C Commercial (0°C to 85°C)
XC3S250E –5 High Performance
CP(G)132 132-ball Chip-Scale Package (CSP)
I Industrial (–40°C to 100°C)
XC3S500E
TQ(G)144 144-pin Thin Quad Flat Pack (TQFP)
XC3S1200E
PQ(G)208 208-pin Plastic Quad Flat Pack (PQFP)
XC3S1600E
FT(G)256 256-ball Fine-Pitch Thin Ball Grid Array (FTBGA)
FG(G)320 320-ball Fine-Pitch Ball Grid Array (FBGA)
FG(G)400 400-ball Fine-Pitch Ball Grid Array (FBGA)
FG(G)484 484-ball Fine-Pitch Ball Grid Array (FBGA)
Notes:
1. The –5 speed grade is exclusively available in the Commercial temperature range.
DS312-1 (v1.1) March 21, 2005
www.xilinx.com
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Advance Product Specification