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| XC3S100E Datasheet, PDF (106/193 Pages) Xilinx, Inc – DC and Switching Characteristics | |||
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DC and Switching Characteristics
Table 5: General DC Characteristics of User I/O, Dual-Purpose, and Dedicated Pins
Symbol
Description
Test Conditions
Min Typ Max Units
IL(2) Leakage current at User I/O,
Driver is in a high-impedance state, â10 - +10 µA
Dual-Purpose, and Dedicated pins VIN = 0V or VCCO max, sample-tested
IRPU(3) Current through pull-up resistor at
VIN = 0V, VCCO = 3.3V
mA
User I/O, Dual-Purpose, and
Dedicated pins
VIN = 0V, VCCO = 3.0V
mA
VIN = 0V, VCCO = 2.5V
mA
VIN = 0V, VCCO = 1.8V
mA
VIN = 0V, VCCO = 1.5V
mA
VIN = 0V, VCCO = 1.2V
mA
IRPD(3) Current through pull-down resistor at
VIN = VCCO
mA
User I/O, Dual-Purpose, and
Dedicated pins
IREF VREF current per pin
CIN Input capacitance
All VCCO levels
â10 - +10 µA
3
-
10 pF
Notes:
1. The numbers in this table are based on the conditions set forth in Table 4.
2. The IL specification applies to every I/O pin throughout power-on as long as the voltage on that pin stays between the absolute VIN minimum
and maximum values (Table 1). For hot-swap applications, at the time of card connection, be sure to keep all I/O voltages within this range
before applying VCCO power. Also consider applying VCCO power before the connection of data lines occurs. When the FPGA is completely
unpowered, the impedance at the I/O pins is high.
3. This parameter is based on characterization. The pull-up resistance RPU = VCCO / IRPU. The pull-down resistance RPD = VIN / IRPD.
DS312-3 (v1.0) March 1, 2005
www.xilinx.com
3
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