XC3S100E Datasheet, PDF (124/193 Pages) Xilinx, Inc – DC and Switching Characteristics

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Pinout Descriptions
Package Overview
Table 2 shows the eight low-cost, space-saving production
package styles for the Spartan-3E family. Each package
style is available as a standard and an environmen-
tally-friendly lead-free (Pb-free) option. The Pb-free pack-
ages include an extra ‘G’ in the package style name. For
example, the standard "VQ100" package becomes
"VQG100" when ordered as the Pb-free option. The
mechanical dimensions of the standard and Pb-free pack-
ages are similar, as shown in the mechanical drawings pro-
vided in Table 4.
Not all Spartan-3E densities are available in all packages.
For a specific package, however, there is a common foot-
print that supports all the devices available in that package.
See the footprint diagrams that follow.
Table 2: Spartan-3E Family Package Options
Package
Leads
Type
Maximum
I/O
VQ100 / VQG100 100 Very-thin Quad Flat Pack (VQFP)
66
CP132 / CPG132 132 Chip-Scale Package (CSP)
92
TQ144 / TQG144 144 Thin Quad Flat Pack (TQFP)
108
PQ208 / PQG208 208 Plastic Quad Flat Pack (PQFP)
158
FT256 / FTG256 256 Fine-pitch, Thin Ball Grid Array (FBGA)
190
FG320 / FGG320 320 Fine-pitch Ball Grid Array (FBGA)
250
FG400 / FGG400 400 Fine-pitch Ball Grid Array (FBGA)
304
FG484 / FGG484 484 Fine-pitch Ball Grid Array (FBGA)
376
Pitch
(mm)
0.5
0.5
0.5
0.5
1.0
1.0
1.0
1.0
Area (mm)
16 x 16
8x8
22 x 22
30.6 x 30.6
17 x 17
19 x 19
21 x 21
23 x 23
Height
(mm)
1.20
1.10
1.60
4.10
1.55
2.00
2.60
2.60
Selecting the Right Package Option
Spartan-3 FPGAs are available in both quad-flat pack
(QFP) and ball grid array (BGA) packaging options. While
QFP packaging offers the lowest absolute cost, the BGA
Table 3: QFP and BGA Comparison
Characteristic
Maximum User I/O
Packing Density (Logic/Area)
Signal Integrity
Simultaneous Switching Output (SSO) Support
Thermal Dissipation
Minimum Printed Circuit Board (PCB) Layers
Hand Assembly/Rework
packages are superior in almost every other aspect, as
summarized in Table 3. Consequently, Xilinx recommends
using BGA packaging whenever possible.
Quad Flat Pack (QFP)
158
Good
Fair
Limited
Fair
4
Possible
Ball Grid Array (BGA)
376
Better
Better
Better
Better
6
Difficult
DS312-4 (v1.1) March 21, 2005
www.xilinx.com
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Advance Product Specification