JG82852GMSL7VP Datasheet, PDF (173/176 Pages) Intel Corporation – Intel® 852GM/852GMV Chipset Intel® 852GM/852GMV Chipset Hub (GMCH)

Ballout and Package Information
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9.1. Package Mechanical Information
The following figures provide detail on the package information and dimensions of the Intel
852GM/852GMV GMCH. The Intel 852GM/852GMV GMCH comes in a Micro-FCBGA package,
which is similar to the mobile processors. The package consists of a silicon die mounted face down on
an organic substrate populated with solder balls on the bottom side. Capacitors may be placed in the
area surrounding the die. Because the die-side capacitors are electrically conductive, and only slightly
shorter than the die height, care should be taken to avoid contacting the capacitors with electrically
conductive materials. Doing so may short the capacitors and possibly damage the device or render it
inactive.
The use of an insulating material between the capacitors and any thermal solution should be considered
to prevent capacitor shorting. An exclusion, or keepout area, surrounds the die and capacitors, and
identifies the contact area for the package. Care should be taken to avoid contact with the package inside
this area.
Figure 12. Intel 852GM/852GMV GMCH Micro-FCBGA Package Dimensions (Top View)
Intel^® 852GM852GMV Chipset GMCH Datasheet
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