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UPD78F9500MA-CAC-A Datasheet, PDF (311/342 Pages) Renesas Technology Corp – 8-Bit Single-Chip Microcontrollers | |||
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CHAPTER 21 RECOMMENDED SOLDERING CONDITIONS
These products should be soldered and mounted under the following recommended conditions.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Caution For soldering methods and conditions other than those recommended below, contact an NEC
Electronics sales representative.
Table 21-1. Surface Mounting Type Soldering Conditions
<R>
⢠10-pin plastic SSOP (lead-free products)
μPD78F9200MA-CAC-A, 78F9201MA-CAC-A, 78F9202MA-CAC-A, 78F9500MA-CAC-A, 78F9501MA-CAC-A,
78F9502MA-CAC-A
Soldering Method
Infrared reflow
Wave soldering
Partial heating
Soldering Conditions
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: 3 times or less, Exposure limit: 7 daysNote (after that, prebake at 125°C for
10 to 72 hours)
For details, contact an NEC Electronics sales representative.
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
Recommended
Condition Symbol
IR60-107-3
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Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Userâs Manual U18172EJ3V0UD
309
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