UPD78F9234MC-5A4-A Datasheet, PDF (376/419 Pages) Renesas Technology Corp – Old Company Name in Catalogs and Other Documents

CHAPTER 25 RECOMMENDED SOLDERING CONDITIONS
Table 25-1. Surface Mounting Type Soldering Conditions (2/2)
• 30-pin plastic SSOP (lead-free products)
μPD78F9232MC(A)-CAB-AX, 78F9234MC(A)-CAB-AX, 78F9232MC(A2)-CAB-AX,
78F9234MC(A2)-CAB-AX
Soldering Method
Infrared reflow
Wave soldering
Partial heating
Soldering Conditions
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: 3 times or less, Exposure limit: 7 days^Note (after that, prebake at 125°C for
10 to 72 hours)
Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120°C max. (package surface temperature), Exposure
limit: 7 days^Note (after that, prebake at 125°C for 10 to 72 hours)
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
Recommended
Condition Symbol
IR60-107-3
WS60-107-1
−
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
• 32-pin plastic SDIP (lead-free products)
μPD78F9232CS-CAA-A, 78F9234CS-CAA-A
Soldering Method
Soldering Conditions
Wave soldering
(only for pins)
Partial heating
Solder bath temperature: 260°C max., Time: 10 seconds max.
Pin temperature: 350°C max., Time: 3 seconds max. (per one pin)
Recommended
Condition Symbol
−
−
Caution Only the pins of the THD are heated when performing wave soldering.
Make sure that flow solder does not come in contact with the package.
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User’s Manual U17446EJ5V0UD