UPD78F9234MC-5A4-A Datasheet, PDF (375/419 Pages) Renesas Technology Corp – Old Company Name in Catalogs and Other Documents

CHAPTER 25 RECOMMENDED SOLDERING CONDITIONS
These products should be soldered and mounted under the following recommended conditions.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Cautions 1. Products with –A or –AX at the end of the part number are lead-free products.
2. For soldering methods and conditions other than those recommended below, contact an NEC
Electronics sales representative.
Table 25-1. Surface Mounting Type Soldering Conditions (1/2)
• 30-pin plastic SSOP (lead-free products)
μPD78F9232MC-5A4-A, 78F9234MC-5A4-A, 78F9232MC(A)-5A4-A, 78F9234MC(A)-5A4-A,
78F9232MC(A2)-5A4-A, 78F9234MC(A2)-5A4-A
Soldering Method
Infrared reflow
Wave soldering
Partial heating
Soldering Conditions
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: 3 times or less, Exposure limit: 7 days^Note (after that, prebake at 125°C for
20 to 72 hours)
For details, contact an NEC Electronics sales representative.
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
Recommended
Condition Symbol
IR60-207-3
−
−
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
User’s Manual U17446EJ5V0UD
373