M16C30P_07 Datasheet, PDF (272/317 Pages) Renesas Technology Corp – 16-BIT SINGLE-CHIP MICROCOMPUTER M16C FAMILY / M16C/30 SERIES

M16C/30P Group
21. Electrical Characteristics
Table 21.28 Electrical Characteristics (2) ⁽¹⁾
Symbol
Parameter
Measuring Condition
Standard
Unit
Min. Typ. Max.
ICC
Power Supply Current
In single-chip
Mask ROM f(XIN)=10MHz
(VCC1=VCC2=2.7V to 3.6V) mode, the output
No division
pins are open and _{One Time}
other pins are VSS _Flash
f(XIN)=10MHz,
No division
8
11 mA
8
13 mA
Flash
Memory
f(XIN)=10MHz,
No division
8
13 mA
Flash Memory f(XIN)=10MHz,
Program
VCC1=3.0V
12
mA
One Time
f(XIN)=10MHz,
Flash Program VCC1=3.0V
12
mA
Flash Memory f(XIN)=10MHz,
Erase
VCC1=3.0V
22
mA
Mask ROM
f(XCIN)=32kHz
Low power dissipation
mode, ROM ⁽³⁾
25
μA
One Time
Flash
f(XCIN)=32kHz
Low power dissipation
mode, RAM ⁽³⁾
25
μA
f(XCIN)=32kHz
Low power dissipation
mode, Flash Memory ⁽³⁾
350
μA
Flash Memory f(XCIN)=32kHz
Low power dissipation
mode, RAM ⁽³⁾
25
μA
f(XCIN)=32kHz
Low power dissipation
mode, Flash Memory ⁽³⁾
420
μA
Mask ROM f(XCIN)=32kHz
One Time Flash Wait mode ⁽²⁾,
6.0
μA
Flash Memory Oscillation capability High
f(XCIN)=32kHz
Wait mode ⁽²⁾,
1.8
μA
Oscillation capability Low
Stop mode
Topr =25°C
0.7 3.0 μA
NOTES:
1. Referenced to VCC1=VCC2=2.7 to 3.3V, VSS = 0V at Topr = −20 to 85°C / −40 to 85°C, f(XIN)=10MHz unless otherwise
specified.
2. With one timer operated using fC32.
3. This indicates the memory in which the program to be executed exists.
Rev.1.22 Mar 29, 2007 Page 256 of 291
REJ09B0179-0122