301467-005 Datasheet, PDF (395/426 Pages) Intel Corporation – Express Chipset

Ballout and Package Information
R
Intel^® 82915GL
GMCH⁶
Intel^® 82915PL Intel^® 82915P
MCH⁵
MCH¹
Intel^® 82915G
GMCH²
Intel^® 82915GV
GMCH³
Intel^® 82910GL
GMCH⁴
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NOTES:
1. DDR, PCI Express* x16 Graphics Interface, No DAC, No Intel^® SDVO
2. DDR, PCI Express* x16 Graphics Interface, DAC, Intel^® SDVO
3. DDR, No PCI Express* x16 Graphics Interface, DAC, Intel^® SDVO
4. DDR (One DIMM per Channel), No PCI Express* x16 Graphics Interface, DAC, Intel^® SDVO
5. DDR (One DIMM per Channel), PCI Express* x16 Graphics Interface, No DAC, No Intel^® SDVO
6. DDR, No PCI Express* x16 Graphics Interface, DAC, Intel^® SDVO
Ball #
B20
B21
B22
C19
C20
C21
C22
D19
D20
D21
D22
E19
E20
E21
E22
F20
F21
F22
G21
G22
H22
14.3
Package Information
The (G)MCH package measures 37.5 mm × 37.5 mm. The 1210 balls are located in a non-grid
pattern. For example, the ball pitch varies from 31.8 mils to 43.0 mils, depending upon the
X-axis or Y-axis direction. Figure 14-7 shows the physical dimensions of the package and
Figure 14-8 shows the (G)MCH keep-out regions.
Datasheet
395