GX1 Datasheet, PDF (40/247 Pages) National Semiconductor (TI) – Processor Series Low Power Integrated x86 Solution

Signal Definitions (Continued)
2.2.6 Internal Test and Measurement Signals (Continued)
Signal Name
BGA
Pin No.
SPGA
Pin No.
Type Description
TEST
TDP
TDN
F3
(PD)
J5
(PD)
E24
F36
D26
E37
I
Test
Test-mode input.
This pin is internally connected to a weak (>20-kohm) pull-down
resistor.
O Thermal Diode Positive
TDP is the positive terminal of the thermal diode on the die. The
diode is used to do thermal characterization of the device in a
system. This signal works in conjunction with TDN.
O Thermal Diode Negative
TDN is the negative terminal of the thermal diode on the die.
The diode is used to do thermal characterization of the device in
a system. This signal works in conjunction with TDP.
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