GX1 Datasheet, PDF(195/247 Page) National Semiconductor (TI) – Processor Series Low Power Integrated x86 Solution

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GX1 Datasheet, PDF (195/247 Pages) National Semiconductor (TI) – Processor Series Low Power Integrated x86 Solution

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Electrical Specifications (Continued)

Table 6-11. 2.0V DC Characteristics for CPU Mode = âOnâ (at Recommended Operating Conditions)

Symbol

Parameter1

Typ

Abs

Avg

Max

Units Comments

ICC3ON

I/O Current @VCC3 = 3.3V (Nominal);

CPU mode = âOnâ ICC3 at fCLK = 300 MHz

ICC2ON

Core Current @VCC2 = 2.0V (Nominal);

CPU mode = âOnâ ICC2 at fCLK = 300 MHz

1. fCLK ratings refer to internal clock frequency.

145

310

mA

ICC for VCC3

970

1240

mA

ICC for VCC2

Table 6-12. 2.0V DC Characteristics for CPU Mode = âActive Idleâ, âStandbyâ, and âSleepâ

(at Recommended Operating Conditions)

Symbol Parameter1

Min

Typ

Max Units Comments

ICC3IDLE

ICC3STBY

ICC3SLP

ICC2IDLE

ICC2STBY

ICC2SLP

I/O Current @VCC3 = 3.3V (Nominal);

CPU mode = "Active Idle"

ICC3IDLE at fCLK = 300 MHz

I/O Current @ VCC3 = 3.3V (Nominal);

CPU mode = "Standby"

I/O Current @ VCC3 = 3.3V (Nominal);

CPU mode = "Sleep"

Core Current @VCC2 = 2.0V (Nominal);

CPU mode = âActive Idleâ

ICC2IDLE at fCLK = 300 MHz

Core Current @ VCC2 = 2.0V (Nominal);

CPU mode = âStandbyâ

Core Current @ VCC2 = 2.0V (Nominal);

CPU mode = âSleepâ

125

mA ICC for VCC3

11

mA

ICC for VCC32

6

mA

ICC for VCC33

250

mA ICC for VCC2

22

mA

ICC for VCC22

10

mA

ICC for VCC23

1. fCLK ratings refer to internal clock frequency.

2. All inputs are at 0.2V or VCC3 â 0.2 (CMOS levels). All inputs except clock are held static, and all outputs are unloaded

(static IOUT = 0 mA)

3. All inputs are at 0.2V or VCC3 â 0.2 (CMOS levels). All inputs are held static, and all outputs are unloaded (static IOUT

= 0 mA).

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