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GX1 Datasheet, PDF (207/247 Pages) National Semiconductor (TI) – Processor Series Low Power Integrated x86 Solution | |||
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7.0 Package Specifications
The thermal characteristics and mechanical dimensions for
the Geode GX1 processor are provided on the following
pages.
7.1 THERMAL CHARACTERISTICS
Table 7-1 shows the junction-to-case thermal resistance of
the SPGA and BGA package and can be used to calculate
the junction (die) temperature under any given circum-
stance.
Table 7-1. Junction-to-Case Thermal Resistance
for SPGA and BGA Packages
Package
θJC
SPGA
BGA
1.7 °C/W
1.1 °C/W
Note that there is no specification for maximum junction
temperature given since the operation of both SPGA and
BGA devices are guaranteed to a case temperature range
of 0°C to 85°C (see Table 6-4 on page 190). As long as the
case temperature of the device is maintained within this
range, the junction temperature of the die will also be main-
tained within its allowable operating range. However, the
die (junction) temperature under a given operating condi-
tion can be calculated by using the following equation:
TJ = TC + (P * θJC)
where:
TJ = Junction temperature (°C)
TC = Case temperature at top center of package (°C)
P = Maximum power dissipation (W)
θJC = Junction-to-case thermal resistance (°C/W)
These examples are given for reference only. The actual
value used for maximum power (P) and ambient tempera-
ture (TA) is determined by the system designer based on
system configuration, extremes of the operating environ-
ment, and whether active thermal management (via Sus-
pend Modulation) of the processor is employed.
A maximum junction temperature is not specified since a
maximum case temperature is. Therefore, the following
equation can be used to calculate the maximum thermal
resistance required of the thermal solution for a given max-
imum ambient temperature:
where:
θCS + θSA = -T---C------Pâ-----T----A--
θCS = Max case-to-heatsink thermal resistance
(°C/W) allowed for thermal solution
θSA = Max heatsink-to-ambient thermal resistance
(°C/W) allowed for thermal solution
TA = Max ambient temperature (°C)
TC = Max case temperature at top center of package
(°C)
P = Max power dissipation (W)
If thermal grease is used between the case and heatsink,
θCS will reduce to about 0.01 °C/W. Therefore, the above
equation can be simplified to:
where:
θCA = -T---C------Pâ-----T----A--
θCA = θCS = Max case-to-ambient thermal resistance
(°C/W) allowed for thermal solution.
The calculated θCA value (examples shown in Table 7-2 on
page 208) represents the maximum allowed thermal resis-
tance of the selected cooling solution which is required to
maintain the maximum TC (shown in Table 6-4 on page
190) for the application in which the device is used.
Revision 1.0
207
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