GX1 Datasheet, PDF (193/247 Pages) National Semiconductor (TI) – Processor Series Low Power Integrated x86 Solution

Electrical Specifications (Continued)
6.5.2.4 DC Current Measurements
The following tables show the DC current measurements for the 1.6V (Tables 6-7 and 6-8),1.8V (Tables 6-9 and 6-10), and
2.0V (Tables 6-11 and 6-12) devices of the GX1 processor series.
Table 6-7. 1.6V DC Characteristics for CPU Mode = “On” (at Recommended Operating Conditions)
Symbol Parameter¹
Typ Abs
Avg Max Units
Comments
I_CC3ON
I/O Current @ V_CC3 = 3.3V (Nominal);
CPU mode = “On”; I_CC3 at f_CLK = 200 MHz
I_CC2ON
Core Current @ V_CC2 = 1.6V (Nominal);
CPU mode = “On”;
I_CC2 at f_CLK = 200 MHz
1. f_CLK ratings refer to internal clock frequency.
165
330
mA I_CC for V_CC3
510
640
mA I_CC for V_CC2
Table 6-8. 1.6V DC Characteristics for CPU Mode = “Active Idle”, “Standby”, and “Sleep”
(at Recommended Operating Conditions)
Symbol Parameter¹
Min
Typ
Max Units
Comments
I_CC3IDLE
I/O Current @ V_CC3 = 3.3V (Nominal);
CPU mode = “Active Idle”
I_CC3IDLE at f_CLK = 200 MHz
150
mA
I_CC for V_CC3
I_CC3STBY I/O Current @ V_CC3 = 3.3V (Nominal);
CPU mode = “Standby”
9
mA
I_CC for V_CC32
I_CC3SLP
I/O Current @ V_CC3 = 3.3V (Nominal);
CPU mode = “Sleep”
4
mA
I_CC for V_CC33
I_CC2IDLE
Core Current @ V_CC2 = 1.6V (Nominal);
CPU mode = “Active Idle”
I_CC2IDLE at f_CLK = 200 MHz
110
mA
I_CC for V_CC2
I_CC2STBY Core Current @ V_CC2 = 1.6V (Nominal);
CPU mode = “Standby”
16
mA
I_CC for V_CC22
I_CC2SLP
Core Current @ V_CC2 =1.6V (Nominal);
CPU mode = “Sleep”
6
mA
I_CC for V_CC23
1. f_CLK ratings refer to internal clock frequency
2. All inputs are at 0.2V or V_CC3 – 0.2 (CMOS levels). All inputs except clock are held static and all outputs are unloaded
(static I_OUT = 0 mA).
3. All inputs are at 0.2V or V_CC3 – 0.2 (CMOS levels). All inputs are held static and all outputs are unloaded (static I_OUT
= 0 mA).
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