GX1 Datasheet, PDF (210/247 Pages) National Semiconductor (TI) – Processor Series Low Power Integrated x86 Solution

Package Specifications (Continued)
7.2 MECHANICAL PACKAGE OUTLINES
Dimensions for the BGA package are shown in Figure 7-2. Figure 7-3 shows the SPGA dimensions. Table 7-3 gives the leg-
end for the symbols used in both package outlines.
.889
REF.
D
D1
S1
D
Seating
Plane
Z
aaa Z
E1
B
1.5
1.5
A1
A2
A
Millimeters
Inches
Sym Min Max Min Max
A
1.35 2.23 0.053 0.088
F
A1 0.40 0.65 0.016 0.026
A2 0.47 0.83 0.019 0.033
aaa
0.20
0.008
B
0.60 0.90 0.024 0.035
D 34.80 35.20 1.370 1.386
D1 31.55 31.95 1.242 1.258
D2 32.80 35.20 1.291 1.386
F
0.35
0.014
S1 1.42 1.82 0.056 0.072
E1
1.27 BASIC
0.05 BASIC
D2
CU Heat
Spreader
A01 Index Chamfer
1.5 mm on a side
45 Degree Angle
Figure 7-2. 352-Terminal BGA Mechanical Package Outline
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