GX1 Datasheet, PDF (211/247 Pages) National Semiconductor (TI) – Processor Series Low Power Integrated x86 Solution

Package Specifications (Continued)
11..6450
REF.
D
D1
S1
D
Pin C3
22..2196
1.52
REF.
45 ^oCHAMFER
(INDEX CORNER)
Millimeters
Inches
Sym Min Max Min Max
A
2.51 3.07 0.099 0.121
F
B
0.41 0.51 0.016 0.020
D 49.28 49.91 1.940 1.965
D1 45.47 45.97 1.790 1.810
F
--
0.127
--
0.005
Diag
Diag
L
2.97 3.38 0.117 0.133
S1 1.65 2.16 0.065 0.085
E1
2.54 BASIC
0.100 BASIC
E2
1.27 BASIC
0.050 BASIC
SEATING
PLANE
L
E2
E1
B
A
D
A01 index mark
.030" blank circle
inside .060" filled
circle to form donut
Figure 7-3. 320-Pin SPGA Mechanical Package Outline
Revision 1.0
211
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