PIC18F6X2X Datasheet, PDF (364/386 Pages) Microchip Technology – 64/80-Pin High Performance, 64-Kbyte Enhanced FLASH Microcontrollers with A/D

PIC18F6X2X/8X2X
29.2 Package Details
The following sections give the technical details of the
packages.
64-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
E
E1
#leads=n1
p
D1 D
2
1
B
n
CH x 45°
A
c
α
A2
L
φ
β
A1
(F)
Units
Dimension Limits
Number of Pins
n
Pitch
p
Pins per Side
n1
Overall Height
A
Molded Package Thickness
A2
Standoff §
A1
Foot Length
L
Footprint (Reference)
(F)
Foot Angle
φ
Overall Width
E
Overall Length
D
Molded Package Width
E1
Molded Package Length
D1
Lead Thickness
c
Lead Width
B
Pin 1 Corner Chamfer
CH
Mold Draft Angle Top
α
Mold Draft Angle Bottom
β
MIN
.039
.037
.002
.018
0
.463
.463
.390
.390
.005
.007
.025
5
5
INCHES
NOM
64
.020
16
.043
.039
.006
.024
.039
3.5
.472
.472
.394
.394
.007
.009
.035
10
10
MAX
.047
.041
.010
.030
7
.482
.482
.398
.398
.009
.011
.045
15
15
MILLIMETERS*
MIN
NOM
64
0.50
16
1.00
1.10
0.95
1.00
0.05
0.15
0.45
0.60
1.00
0
3.5
11.75
12.00
11.75
12.00
9.90
10.00
9.90
10.00
0.13
0.18
0.17
0.22
0.64
0.89
5
10
5
10
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-085
MAX
1.20
1.05
0.25
0.75
7
12.25
12.25
10.10
10.10
0.23
0.27
1.14
15
15
DS39612A-page 362
Advance Information
 2003 Microchip Technology Inc.