GMS30C2116 Datasheet, PDF (172/322 Pages) Hynix Semiconductor – USERS MANUAL

7-10
7.4 Package-Dimensions
D
D1
CHAPTER 7
Index
P
b
θ
L
Figure 7.4: GMS30C2132, GMS30C2116 Package-Outline
Symbol Term
Definition
A1
Standoff height
Height from ground plane to bottom edge of package
A2
Package height
Height of package itself
E, D
Overall length & width
Length and width including leads
D1, E1 Package length & width Length and width of package
L
Length of flat lead
section
Length of flat lead section
P
Lead pitch
Lead pitch
b
Lead width
Width of a lead
θ
Lead angle
Angle of lead versus seating plane