MC9S12P128 Datasheet, PDF (505/564 Pages) Freescale Semiconductor, Inc – S12 Microcontrollers

Electrical Characteristics
4. Junction to case thermal resistance was simulated to be equivalent to the measured values using the cold plate technique with
the cold plate temperature used as the “case” temperature. This basic cold plate measurement technique is described by MIL-
STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when the package is
being used with a heat sink.
5. Thermal characterization parameter Ψ_JT is the “resistance” from junction to reference point thermocouple on top center of the
case as defined in JESD51-2. Ψ_JT is a useful value to use to estimate junction temperature in a steady state customer
enviroment.
6. Junction to case thermal resistance was simulated to be equivalent to the measured values using the cold plate technique with
the cold plate temperature used as the “case” temperature. This basic cold plate measurement technique is described by MIL-
STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when the package is
being used with a heat sink.
7. Thermal characterization parameter Ψ_JT is the “resistance” from junction to reference point thermocouple on top center of the
case as defined in JESD51-2. Ψ_JT is a useful value to use to estimate junction temperature in a steady state customer
enviroment.
S12P-Family Reference Manual, Rev. 1.12
Freescale Semiconductor
505