MC9S12P128 Datasheet, PDF (504/564 Pages) Freescale Semiconductor, Inc – S12 Microcontrollers

Electrical Characteristics
P_IO is the sum of all output currents on I/O ports associated with V_DDX, whereby
RDSON = ^{V--I--O-O----L-L--;for} outputs driven low
RDSON = ^{V-----D----D-----3}_I--O-⁵----H^–-----V----O-----H---;for outputs driven high
PINT = IDDR ⋅ VDDR + IDDA ⋅ VDDA
Table A-5. Thermal Package Characteristics⁽¹⁾
Num C
Rating
Symbol
Min
Typ
Max
Unit
QFN 48
1 D Thermal resistance QFN 48, single sided PCB⁽²⁾
θ_JA
—
—
82
°C/W
2 D Thermal resistance QFN 48, double sided PCB
with 2 internal planes⁽³⁾
θ_JA
—
—
28
°C/W
3 D Junction to Board QFN 48
4 D Junction to Case QFN 48⁴
5 D Junction to Case (Bottom) QFN 48⁵
θ_JB
—
—
11
°C/W
θ_JC
—
—
1.4
°C/W
Ψ_JT
—
—
4
°C/W
QFP 80
6 D Thermal resistance QFP 80, single sided PCB²
θ_JA
—
—
56
°C/W
7 D Thermal resistance QFP 80, double sided PCB
with 2 internal planes³
θ_JA
—
—
43
°C/W
8 D Junction to Board QFP 80
9 D Junction to Case QFP 80⁽⁴⁾
10 D Junction to Package Top QFP 80⁽⁵⁾
θ_JB
—
—
28
°C/W
θ_JC
—
—
19
°C/W
Ψ_JT
—
—
5
°C/W
LQFP 64
11 D Thermal resistance LQFP 64, single sided PCB²
θ_JA
—
—
70
°C/W
12 D Thermal resistance LQFP 64, double sided PCB
with 2 internal planes³
θ_JA
—
—
52
°C/W
13 D Junction to Board LQFP 64
θ_JB
—
—
35
°C/W
14 D Junction to Case LQFP 64⁽⁶⁾
θ_JC
—
—
17
°C/W
15 D Junction to Package Top LQFP 64⁽⁷⁾
Ψ_JT
—
—
1. The values for thermal resistance are achieved by package simulations
3
°C/W
2. Junction to ambient thermal resistance, θ_JA was simulated to be equivalent to the JEDEC specification JESD51-2 in a
horizontal configuration in natural convection.
3. Junction to ambient thermal resistance, θ_JA was simulated to be equivalent to the JEDEC specification JESD51-7 in a
horizontal configuration in natural convection.
S12P-Family Reference Manual, Rev. 1.12
504
Freescale Semiconductor