MC9S12NE64V1 Datasheet, PDF (508/554 Pages) Freescale Semiconductor, Inc – MC9S12NE64V1 Data Sheet

Appendix A Electrical Characteristics
Table A-5. Thermal Package Characteristics ¹
Num C
Rating
Symbol Min
1
T Thermal Resistance LQFP112, single sided PCB ²
θ_JA
—
2
Thermal Resistance LQFP112, double sided PCB with
T _{two internal planes 3}
θ_JA
—
3
T Junction to Board LQFP112
θ_JB
—
4
T Junction to Case LQFP112
θ_JC
—
5
T Junction to Package Top LQFP112
Ψ_JT
—
6
T Thermal Resistance TQFP-EP80, single sided PCB
θ_JA
—
7
T
Thermal Resistance TQFP-EP80, double sided PCB
with two internal planes
θ_JA
—
8
T Junction to Board TQFP-EP80
θ_JB
—
9
T Junction to Case TQFP-EP80
θ_JC
—
10
T Junction to Package Top TQFP-EP80
Ψ_JT
—
6
T
Thermal Resistance Epad TQFP-EP80, single sided
PCB
θ_JA
—
7
T
Thermal Resistance Epad TQFP-EP80, double sided
PCB with two internal planes
θ_JA
—
8
T Junction to Board TQFP-EP80
θ_JB
—
9
T Junction to Case TQFP-EP80 ⁴
θ_JC
—
10
T Junction to Package Top TQFP-EP80
Ψ_JT
—
1 _{The values for thermal resistance are achieved by package simulations}
2 _{PC Board according to EIA/JEDEC Standard 51-3}
3 _{PC Board according to EIA/JEDEC Standard 51-7}
4 _{Thermal resistance between the die and the exposed die pad.}
Typ
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Max
54
41
31
11
2
51
41
27
14
3
48
Unit
o_C/W
o_C/W
o_C/W
o_C/W
o_C/W
o_C/W
o_C/W
o_C/W
o_C/W
o_C/W
o_C/W
24
o_C/W
10
o_C/W
0.7
o_C/W
2
o_C/W
A.9 I/O Characteristics
This section describes the characteristics of all 3.3 V I/O pins. All parameters are not always
applicable; e.g., not all pins feature pullup/pulldown resistances.
MC9S12NE64 Data Sheet, Rev. 1.1
508
Freescale Semiconductor