SM320F2812-HT Datasheet, PDF (22/155 Pages) Texas Instruments – Digital Signal Processor

SM320F2812-HT
SGUS062A – JUNE 2009 – REVISED APRIL 2010
www.ti.com
NAME
V_DD
V_DD
V_DD
V_DD
V_DD
V_DD
V_DD
V_DD
V_DD
V_DD
V_SS
V_SS
V_SS
V_SS
V_SS
V_SS
V_SS
V_SS
V_SS
V_SS
V_SS
V_SS
V_SS
V_SS
V_SS
V_SS
V_DDIO
V_DDIO
V_DDIO
V_DDIO
V_DDIO
V_DDIO
V_DD3VFL
PIN NO.
172-PIN
HFG
22
36
55
73
-
98
110
125
140
150
-
31
37
51
57
-
76
84
97
103
111
-
126
139
-
-
30
63
79
-
112
142
68
Table 2-3. Signal Descriptions ⁽¹⁾ (continued)
DIE PAD
NO.
DIE PAD
X-CENTER
(mm)
29
2927.6
43
4395.4
62
5361.5
86
5361.5
98
5361.5
113
3861.3
125
2451.9
141
663.7
156
42.6
169
42.6
25
2517.7
38
3871.3
44
4490.7
58
5361.5
65
5361.5
79
5361.5
89
5361.5
97
5361.5
112
3956.0
118
3280.5
126
2357.2
133
1587.1
142
569.0
155
42.6
159
42.6
168
42.6
37
3776.0
73
5361.5
92
5361.5
105
4784.7
127
2262.5
160
42.6
78
5361.5
DIE PAD
Y-CENTER
(mm)
I/O/Z ⁽²⁾
POWER SIGNALS
42.6
42.6
1256.0
3496.4
4671.835
5057.5
5057.5
5057.5
3845.1
2635.3
42.6
42.6
42.6
869.2
1514.6
2818.6
3754.9
4585.7
5057.5
5057.5
5057.5
5057.5
5057.5
3915.2
3580.8
2705.4
42.6
2226.0
4051.2
5057.5
5057.5
3510.7
2732.4
PU/PD ⁽³⁾
DESCRIPTION
1.8-V or 1.9-V Core Digital Power Pins. See
Section 6.2, Recommended Operating
Conditions, for voltage requirements.
Core and Digital I/O Ground Pins
3.3–V I/O Digital Power Pins
3.3–V Flash Core Power Pin. This pin
should be connected to 3.3 V at all times
after power-up sequence requirements
have been met. This pin is used as VDDIO
in ROM parts and must be connected to
3.3 V in ROM parts as well.
22
Introduction
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