SM320F2812-HT Datasheet, PDF (15/155 Pages) Texas Instruments – Digital Signal Processor

SM320F2812-HT
www.ti.com
SGUS062A – JUNE 2009 – REVISED APRIL 2010
2.3 Die Layout
The SM320F2812 die layout is shown in Figure 2-1. See Table 2-3 for a description of each pad's
function.
Figure 2-1. SM320F2812 Die Layout
Table 2-2. Bare Die Information
DIE SIZE
DIE PAD SIZE
219.4 x 207.0 (mils);
5572.0 x 5258.0 (mm)
55.0 x 64.0 (mm)
DIE PAD
COORDINATES
See Table 2-3
DIE
THICKNESS
DIE PAD
COMPOSITI
ON
11.0 mils
AlCu/TiN
BACKSIDE
FINISH
Silicon with
backgrind
BACKSIDE
POTENTIAL
Ground
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Introduction
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