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N25Q032A13E1241F Datasheet, PDF (149/153 Pages) Micron Technology – 32-Mbit 3 V, multiple I/O, 4-Kbyte subsector erase, XiP enabled, serial flash memory with 108 MHz SPI bus interface | |||
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N25Q032 - 3 V
Package mechanical
Table 38. TBGA 6x8 mm 24-Ball, Dimensions, Symbols A to eE
Symbol
mm
A
A1
A2
θb
D
D1
E
E1
eD
eE
Typ
â
0.20
â
0.35
5.90
â
7.90
â
â
â
Min
â
â
0.79
0.40
6.00
4
8
4
1
1
Max
1.20
â
â
0.45
6.10
â
8.10
â
â
â
Table 39. TBGA 6x8 mm 24-Ball, Dimensions, Symbols FD to fff
Symbol
mm
FD
FE
MD
ME
n
aaa
bbb
ddd
eee
fff
Typ
â
â
5
5 24 balls â
â
â
â
â
Min
1
2
5
5 24 balls â
â
â
â
â
Max
â
â
5
5 24 balls 0.15
0.10
0.10
0.15
0.08
Figure 116. SO8N â 8 Lead Plastic Small Outline, 150 mils Body Width, Drawing
h x 45Ë
A2
b
e
A
ccc
D
8
E1 E
1
A1
c
0.25 mm
GAUGE PLANE
k
L
L1
1. Drawing is not to scale.
Table 40. SO8N â 8 Lead Plastic Small Outline, 150 mils Body Width, Dimensions
Symbol
mm
A A1 A2 b
c ccc D
E E1 e
h
k
L L1
Typ â â â â â â 4.90 6 3.90 1.27 â â â 1.04
Min â 0.10 1.25 0.28 0.17 â 4.80 5.80 3.80 â 0.25 0° 0.40 â
Max 1.75 0.25 â 0.48 0.23 0.10 5 6.20 4
â 0.50 8° 1.27 â
149/153
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2010 Micron Technology, Inc. All rights reserved.
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