N25Q032A13E1241F Datasheet, PDF (145/153 Pages) Micron Technology – 32-Mbit 3 V, multiple I/O, 4-Kbyte subsector erase, XiP enabled, serial flash memory with 108 MHz SPI bus interface

N25Q032 - 3 V
Package mechanical
Figure 112. VDFPN8 (MLP8) Very Thin Dual Flat Package 8 leads, 8×6x1 mm Drawing
A
B
D
2X
aaa C
CL
A
A1
Pin 1 ID R 0.20
Ø0,3
CL
8
1
7
2
6
3
5
4
LK
D2
ISO E
1. Drawing is not to scale.
2. The circle in the top view of the package indicates the position of pin 1.
Table 35. VDFPN8 (MLP8) Very Thin Dual Flat Package 8 leads 8×6x1 mm Dimensions
Symbol
mm
A
A1
b
D
D2
E
E2
e
K
L
Typ
0.85
—
0.4
8
5.16
6
4.8
1.27
(basic)
—
0.5
Min
—
0
0.35
—
—
—
—
1.27
(basic)
0.2
0.45
Max
1
0.05 0.48
—
—
—
—
1.27
(basic)
—
0.6
145/153
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2010 Micron Technology, Inc. All rights reserved.