N25Q032A13E1241F Datasheet, PDF (143/153 Pages) Micron Technology – 32-Mbit 3 V, multiple I/O, 4-Kbyte subsector erase, XiP enabled, serial flash memory with 108 MHz SPI bus interface

N25Q032 - 3 V
15 Package mechanical
Package mechanical
To meet environmental requirements, Numonyx offers these devices in RoHS compliant
packages, which have a lead-free second level interconnect. The category of second level
interconnect is marked on the package and on the inner box label in compliance with
JEDEC Standard JESD97. Maximum ratings related to soldering conditions are also marked
on the inner box label.
Figure 110. UFDFPN8 (MLP8) Ultra Thin Dual Flat Package, No lead, 4×3 mm Drawing
D
A
B
0.20 DIA TYP.
E
2X d 0.10 C
2X d 0.10 C
1
2
TOP VIEW
6 ^{f 0.10 C}
C
d 0.05 C ^A
SEATING PLANE
A3 A1
SIDE VIEW
THIRD ANGLE
PROJECTION
INTERPRET DIM AND TOL PER
ASME Y14.5M - 1994
DATUM A OR B
(DATUM A)
6
E2
D2
D2
1
2
NX L
(DATUM B)
SEE DETAIL "A"
N N-1
e
(ND-1) X e
2
NX b 3
j 0.10 M C A B
j 0.05 M C
e
e/2
EVEN TERMINAL/SIDE
DETAIL "A"
3
TERMINAL TIP
BOTTOM VIEW
1. Drawing is not to scale.
Table 33. UFDFPN8 (MLP8) Ultra Thin Dual Flat Package, No lead, 4×3 mm Dimensions
Symbol
mm
A
A1 A3
θ
D2 E2
e
N
ND
b
L
D
E
Typ 0.55 0.02 —
— 0.80 0.20 0.80 8
Min 0.45 0 0.127 0° 0.70 0.10 —
—
Max 0.60 0.05 0.15 12° 0.90 0.30 —
—
4 0.30 0.60 4
3
— 0.25 0.55 3.90 2.90
— 0.35 0.65 4.10 3.10
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