N25Q032A13E1241F Datasheet, PDF (144/153 Pages) Micron Technology – 32-Mbit 3 V, multiple I/O, 4-Kbyte subsector erase, XiP enabled, serial flash memory with 108 MHz SPI bus interface

Package mechanical
N25Q032 - 3 V
Figure 111. VDFPN8 (MLP8) Very Thin Pitch Dual Flat Package, No lead, 6×5 mm
Drawing
A
D
R1
D1
B
aaa C A
E E1
E2
e
2x
0.10 C B
b
0.10 C A
θ
A2
D2
L
A A1 A3
ddd
C
1. Drawing is not to scale.
2. The circle in the top view of the package indicates the position of pin 1.
Table 34.
mm
A
VDFPN8 (MLP8) Very Thin Dual Flat Package No leads 6×5 mm Dimensions
Symbol
A1 A2 A3 b D D1 D2 E E1 E2 e R1 L Q aaa bbb ddd
Typ 0.85 — 0.65 0.20 0.40 6 5.75 3.40 5 4.75 4 1.27 0.10 0.60 — — — —
Min 0.80 0 — — 0.35 — — 3.20 — — 3.80 — 0 0.50 — — — —
Max 1 0.05 — — 0.48 — — 3.60 — — 4.30 — — 0.75 12° 0.15 0.10 0.05
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