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N25Q032A13E1241F Datasheet, PDF (135/153 Pages) Micron Technology – 32-Mbit 3 V, multiple I/O, 4-Kbyte subsector erase, XiP enabled, serial flash memory with 108 MHz SPI bus interface
N25Q032 - 3 V
13 Maximum rating
Maximum rating
Stressing the device outside the ratings listed here may cause permanent damage to the
device. These are stress ratings only, and operation of the device at these, or any other
conditions outside those indicated in the operating sections of this specification, is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Table 26. Absolute maximum ratings
Symbol
Parameter
Min
Max Unit
TSTG
TLEAD
Storage temperature
Lead temperature during soldering
–65
150
°C
see(1)
°C
VIO
Input and output voltage (with respect to ground)
–0.6 VCC + 0.6 V
VCC
Supply voltage
–0.6
4.0
V
VPP Fast program/erase voltage
–0.2
10.0
V
VESD Electrostatic discharge voltage (human body model)(2) –2000
2000
V
1. Compliant with JEDEC Std. J-STD-020C (for small body, Sn-Pb or Pb assembly), the Numonyx
ECOPACK® 7191395 specification, and the European directive on Restrictions on Hazardous
Substances (RoHS) 2002/95/EU.
2. JEDEC Std JESD22-A114A (C1 = 100 pF, R1 = 1500 Ω, R2 = 500 Ω).
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