AMD-K6-2E Datasheet, PDF (312/332 Pages) Advanced Micro Devices – AMD-K6™-2E Embedded Processor

AMD-K6™-2E Processor Data Sheet
Preliminary Information
22529B/0—January 2000
Soldered Installation:
Maximum Ambient
Temperature
Table 72 and Figure 108 show the measured maximum ambient
temperature (T_A) values in °C at different levels of airflow in
the system for the low-power embedded AMD-K6-2E processors
with a maximum thermal power dissipation of 10.0 watts (for
OPNs: AMD-K6-2E/266AMZ, AMD-K6-2E/300AMZ, and
AMD-K6-2E/333AMZ) and a maximum case temperature rating
of 85 °C, in the 321-pin Ceramic Pin Grid Array package (CPGA)
when soldered into a printed circuit board.
.
Table 72. Soldered CPGA Package: Measured Maximum Ambient Temperature (°C)
Heatsink Type
No Heatsink
A (15 mm)
B (20 mm)
C (30 mm)
0.0 m/s
14°C
33°C
36°C
42°C
Maximum T_A (°C) v. Airflow (m/s)
1.0 m/s
31°C
51°C
56°C
60°C
2.0 m/s
42°C
61°C
65°C
69°C
3.0 m/s
53°C
66°C
70°C
71°C
4.0 m/s
58°C
68°C
72°C
73°C
T_C = 85°C, P_d = 10 W
80
70
60
50
40
30
20
10
0
0
1
2
3
4
Airflow Rate (m/s)
1RQH
$
%
&
Figure 108. Measured Maximum Ambient Temperature (Soldered, 321-Pin CPGA Package)
294
Thermal Design
Chapter 16