AMD-K6-2E Datasheet, PDF (309/332 Pages) Advanced Micro Devices – AMD-K6™-2E Embedded Processor

22529B/0—January 2000
Preliminary Information
AMD-K6™-2E Processor Data Sheet
Socketed Installation:
Case-to-Ambient
Thermal Resistance
Table 69 and Figure 105 show the measured values for the case-
to-ambient thermal resistance (q_CA in °C/watt) at different
levels of airflow in the system for the low-power embedded
AMD-K6-2E processors with a maximum thermal power
dissipation of 10.0 watts (OPNs: AMD-K6-2E/266AMZ,
AM D-K6 -2E/ 300 AMZ , and AMD - K6 -2 E/ 33 3A MZ) and a
maximum case temperature rating of 85°C, in the 321-pin
Ceramic Pin Grid Array package (CPGA) when installed into a
socket.
Table 69. Socketed CPGA Package: Measured Thermal Resistance (°C/W) q_JC and q_CA
Heatsink Type
No Heatsink
A (15 mm)
B (20 mm)
C (30 mm)
q_JC (°C/W)
1.0
1.0
1.0
1.0
0.0 m/s
9.1
6.5
5.7
4.7
q_CA (°C/W) v. Airflow (m/s)
1.0 m/s
7.5
4.3
3.8
2.8
2.0 m/s
6.1
3.1
2.7
1.8
3.0 m/s
4.7
2.6
2.3
1.5
4.0 m/s
4.0
2.3
2.0
1.3
10
9
8
7
6
5
4
3
2
1
0
0
1
2
3
4
Airflow Rate (m/s)
None
A
B
C
Figure 105. Measured Thermal Resistance v. Airflow (Socketed 321-Pin CPGA Package)
Chapter 16
Thermal Design
291